Principal CMOS Process Integration Engineer – 3D NAND Yield

Micron Technology, Inc. in Singapore seeks a Staff/Principal NAND CMOS Module Process Integration Engineer to design and implement advanced process solutions for next-generation 3D NAND yield and quality, balancing cost and performance. You will lead cross-functional teams, refine CSPEC criteria, and drive technology transfer to manufacturing, with quarterly yield reviews and ongoing R&D collaboration. Willingness to travel to the US for extended periods is required. J-18808-Ljbffr