Platform Technology Lead, Advanced Packaging & 2.5D

A*STAR - Agency for Science, Technology and Research in Singapore seeks a results-oriented leader to steer platform technology integration in Advanced Packaging.

The role

focuses on defining a medium-to-long term process capability roadmap and developing 2.5D TSV interposers, integrating optics with electronics via advanced bonding technologies for high-performance networking interconnects. You will build and mentor a high-performing team, manage cross-functional projects, engage industry J-188…