Lead Dry Etch Process Engineer – Global Yield & Innovation

Micron Technology, Inc. in Singapore is seeking a Principal Engineer for FE OCT CPEE HVM Dry Etch. Lead productivity and yield initiatives across Dry Etch modules, coordinating with global sites to optimize chamber performance and process parameters. You will advance CIP roadmaps, partner with suppliers, and drive safety, efficiency, and sustainability while enabling AI-enabled insights for process optimization. J-18808-Ljbffr