发布于 2026年10月02日 · 我们于 2026年10月02日 确认该职位仍然有效
这是您的公司吗?€ 750 – € 1.500 (每个项目)
I’m developing a new medical device and need a multi-layer printed circuit board engineered from the ground up. The board must be laid out with full consideration for IEC 60601 safety requirements, including creepage/clearance rules, isolation barriers, and low-leakage current paths suitable for patient-connected electronics. Scope of work • Translate my functional block diagram and preliminary schematic into a production-ready multi-layer PCB. • Optimize component placement for signal integrity, EMI/EMC, and thermal dissipation typical of medical environments. • Provide complete manufacturing data: Gerber/ODB++ files, drill files, stack-up, controlled-impedance notes, BOM, and pick-and-place. • Document the design with a brief compliance report highlighting how IEC 60601 considerations were met. • Prepare fabrication and assembly drawings so the board can move straight to prototype builds. Preferred tools Altium Designer is ideal, but I can work with KiCad or Allegro as long as output meets standard fab requirements. Acceptance I’ll review the layout for IEC 60601 alignment, DFM/DFT readiness, and net-class rule implementation. Final payment releases once the board passes a manufacturing rule check and my contract assembler confirms the files are build-ready. If you have prior experience in medical electronics and multi-layer stack-ups, I’d love to see examples.