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Lead Electroplating Process Engineer – Advanced Packaging

APPLIED MATERIALS SINGAPORE TECHNOLOGY PTE. LTD.

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placeSingapore home_work现场 labelEngineering Jobs public聚合职位 · SG

event发布于 2026年10月18日 · verified我们于 2026年11月04日 确认该职位仍然有效

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SGD 1.800 – SGD 2.520 / 年

职位介绍

Applied Materials is seeking a Manager, Process Engineering (Electroplating) to lead development and optimization of next-generation electroplating processes at our Singapore APDC. You will manage a team of engineers, drive technology innovation, and collaborate with global cross-functional groups to deliver advanced packaging solutions; located at Science Park II, moving to Tampines in 2027. J-18808-Ljbffr

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