Lead Electroplating Process Engineer – Advanced Packaging

Applied Materials is seeking a Manager, Process Engineering (Electroplating) to lead development and optimization of next-generation electroplating processes at our Singapore APDC. You will manage a team of engineers, drive technology innovation, and collaborate with global cross-functional groups to deliver advanced packaging solutions; located at Science Park II, moving to Tampines in 2027. J-18808-Ljbffr