Engineering Director (Advanced Semiconductor Packaging)

Lead multi-discipline teams: process, mechanical, electrical and controls, software, optics and metrology, systems and lab Own system architecture and the placement and overlay error budget, from concept through to a qualified tool at customer sites Set the alignment strategy, including camera architecture, mark design rules, calibration and closed-loop overlay correction Manage engineering budget, schedule, technical risk and make-vs-buy decisions Work with Applications, Quality and Operations…